From: rpi@well.sf.ca.us (David Reed)
Subject: TECH:  RPI headmount & user data
Date: Tue, 2 Feb 1993 23:23:51 GMT
Organization: Whole Earth 'Lectronic Link



RPI Advanced Technology Group is delivering Beta-Site Head Mount
Sensory Interface devices currently. A color photograph of a typical
CAD unit can be seen on page 55 of the March 1993 AI Expert Magazine.
Volume releases of the CAD HMSI(TM) will be provided through RPI upon
completion of final funding. GameGoggle(TM) HMSI devices will be
volume released through third parties. Ramp-up for plates, housings
and extension peripherals has already begun. Applications for the HMSI
include Simulation, Multimedia, Multi-tainment and VR. RPI is seeking
additional quantifiable market data in games, CAD, medical and
aerospace areas. RPI will consider trade/barter arrangements in
exchange for user studies. For more information:


RPI Advanced Technology Group
POB 14607
San Francisco, CA, USA, 94114

VOICE/FAX: 415-777-3226

EM: rpi@well.sf.ca     Attn: Anthony