HP Introduces 3-Volt RF Chip Set For 1.5-2.5GHz Cordless Telephone, PCs And
WLAN Applications

SANTA CLARA, CALIFORNIA. FEBRUARY 14, 1996 -- Hewlett-Packard Company today
introduced an economical three-chip integrated-circuit set that provides
nearly all of the active radio- frequency functions needed for several
wireless applications in the 1.5 to 2.5GHz frequency range. All of the ICs
operate at the 3-volt level. The announcement was made here at the 1996
Wireless Symposium.

Applications include personal communications systems in the U.S. operating
1,900MHz frequency bands; digital European cordless telephones (DECT) in
the 1,880MHz to 1,900MHz frequency range; and both voice systems and data
modems designed for unlicensed operation in the U.S. 2,400- to 2,500-MHz
industrial, scientific and medical (ISM) band, and similar frequencies in
other countries.

HP's three-chip set, which requires a minimum number of additional external
components, is designed to help wireleses manufacturers quickly bring
their products to market. Its dual-downconversion architecture distributes
system gain at different frequencies, minimizing design difficulties and
making equipment easier to manufacture and permitting the use of a high
(greater than 250MHz) second intermediate frequency, which allows
manufacturers to use physically smaller IF filters.

The HPMX-5001 1.5-2.5GHz Up/downconverter incorporates a half-rate VCO with
a 32/33 dual-modulus prescaler. It is a highly integrated building block
that can be used in a number of different systems. The upconverter output
power is 2dBm, and the downconverter conversion gain is 14dB and with 10dB
noise figure. The HPMX-5001 is contained in a 32-pin TQFP package.

The HPMX-5002 IF Modulator/Demodulator includes a VCO, prescalers, phase
frequency detector, downconverter (to a second IF), limiting amplifier
chain, data slicer and received signal-strength indicator (RSSI) circuitry
with >75 dB range. During receive, it accepts a downconverted signal from
the HPMX-5001 and produces a demodulated output. On transmit, it accepts
data from baseband circuitry and produces a modulated signal that is then
upconverted by the HPMX- 5001.  This functionality is contained in a
48-pin TQFP package.

The HPMX-3003 LNA/switch/power amplifier is a GaAs IC with a low- noise
amplifier (2.2dB NF and 13dB gain @ 2GHz), a T/R switch ( with 55dBm
third-order intercept point), and a power amplifier combining +27.5dBm
output power with 23. 5dB gain (at 3.6 V). All three functions are fully
accessible for filtering or other signal-processing functions and are
contained in a 28-pin SSOP package.

U.S. Prices

                   Quantities
                     10,000

 HPMX-5001          $5.35 ea.
 HPMX-5002           8.90 ea.
 HPMX-3003           7.20 ea.
 Total set:         21.45 ea.

These chips will be available through distribution by the end of this
month.

Hewlett-Packard Company is a leading global manufacturer of computing,
communications and measurement products and services recognized for
excellence in quality and support. HP has 102,300 employees and had
revenue of $31.5 billion in its 1995 fiscal year.

Information about HP and its products can be found on the World Wide Web at
http://www.hp.com.

Information in this release applies specifically to products available in
the United States. Product availability and specifications may vary in
non-U.S. markets.
 
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